Applicable fibers: Single / SMF (G.652/657), MMF (G.651), DSF (G.653), NZDSF (G.655)
Cladding dia. / Sheath dia.: 80-150μm / 100-3000μm
Cleave length: 5mm to 16mm with sheath clamp
Splice mode / heating mode: Total 100 splice modes / 30 heating modes
Splice loss: 0.02dB (SM), 0.01dB (MM), 0.04dB (DSF) and 0.04dB (NZDS)
Measured by cut-back method relevant to ITU-T and IEC standards.
Attenuation splice function: Intentional high splice loss of 0.1dB to 15dB（0.1dB step）can be made for an in-line fixed attenuator.
Splice time/tube heating time: Typical 7sec with SM / Typical 14sec with FP-03 (60mm) sleeve
Splice result storage: Last 2000 splices
Viewing methods/magnification: 2 axis CMOS camera with 4.73″ color LCD.
X / Y (320X magnification), or both X and Y simultaneously (200X magnification)
Tension test: 1.96 to 2.25N
Applicable protection sleeve: 60mm, 40mm and Fujikura micro sleeves
No. of splice/heating per battery full charge: Typical 200 cycles with BTR-09 (one splicing and heating cycle per two min. under room temperature condition).
Electrode life: 3000 splices
Size/weight: 146W x 159D x 150H (mm) / 2.7kg (including battery)
Operating condition:
– Altitude 0 to 5,000m above sea level
– Wind 15m/sec
– Temperature -10 to 50deg C
– Humidity 0 to 95%RH, non-dew
Resistance features:
– Shock 76cm (30inch) all surface drop
– Dust Exposure to dust (0.1 to 500μm dia Alumina Silicate), IP5X
– Rain H=10mm/hr for 10min, IPX2
(Carried out in Fujikura labs in Japan. The shock, dust and rain resistance test do not guarantee the product will not be damaged under these conditions)
Other features: PC software upgrade/data management
Terminals: USB 2.0 (Mini-B type) connector for PC communication.
6-pin Mini-DIN connector for HJS-02 or HJS-03 power supply.